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  1. 06.05.2026

    Endlich aus dem Gefängnis entlassen, schwören sich die fünf Freunde Teapot (Sammo Hung), Exhaust ...

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  2. 07.06.2026

    This book focuses on the design, materials, process, fabrication, quality, reliability, fatigue, ...

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  3. 27.08.2015

    A comprehensive guide to 3D IC integration and packaging technology3D IC Integration and Packagin...

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    198,50 €
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  4. 30.05.2020

    This book focuses on the assembly and reliability of lead-free solder joints. Both the principles...

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    171,19 €
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  5. 12.04.2019

    Heterogeneous integration uses packaging technology to integrate dissimilar chips, LED, MEMS, VCS...

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    171,19 €
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  6. 17.07.2000

    These are the proceedings of the First International Conference on Compu- tional Logic (CL 2000) ...

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    53,49 €
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  7. 16.12.2018

    This comprehensive guide to fan-out wafer-level packaging (FOWLP) technology compares FOWLP with ...

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    117,69 €
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  8. 30.04.2012

    Microelectronics packaging and interconnection have experienced exciting growth stimulated by the...

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    160,49 €
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  9. 23.02.2014

    Solders have given the designer of modern consumer, commercial, and military electronic systems a...

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    213,99 €
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  10. 31.01.1994

    The Mechanics of Solder Alloy Interconnects is a resourceto be used in developing a solder joint ...

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  11. 18.05.2021

    The book focuses on the design, materials, process, fabrication, and reliability of advanced semi...

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    171,19 €
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  12. 13.04.2018

    This comprehensive guide to fan-out wafer-level packaging (FOWLP) technology compares FOWLP with ...

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    160,49 €
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  13. 31.01.1992

    Handbook of tape automated bonding (TAB) is a one-stop guide tothe state of the art of TAB techno...

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    213,99 €
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  14. 25.11.2010

    In this volume, phenomenologists from the West join hands with specialists from mainland China an...

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    106,99 €
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  15. 30.05.2021

    This book focuses on the assembly and reliability of lead-free solder joints. Both the principles...

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    123,04 €
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  16. 19.05.2022

    The book focuses on the design, materials, process, fabrication, and reliability of advanced semi...

    Taschenbuch

    Unser bisheriger Preis:ORGPRICE: 128,39 €

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  17. 28.03.2023

    The book focuses on the design, materials, process, fabrication, and reliability of chiplet desig...

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    192,59 €
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  18. 29.02.2024

    Providing a comprehensive overview of the benefits of mindfulness for children and adolescents, t...

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    Unser bisheriger Preis:ORGPRICE: 206,50 €

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  19. 24.05.2024

    This book focuses on the design, materials, process, fabrication, and reliability of flip chip, h...

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    Unser bisheriger Preis:ORGPRICE: 181,89 €

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  20. 29.03.2024

    The book focuses on the design, materials, process, fabrication, and reliability of chiplet desig...

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    139,09 €
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  21. 19.05.2025

    The book focuses on the design, materials, process, fabrication, failure mechanism, reliability, ...

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    192,59 €
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  22. 27.06.2025

    Providing a comprehensive overview of the benefits of mindfulness for children and adolescents, t...

    Taschenbuch

    Unser bisheriger Preis:ORGPRICE: 65,40 €

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  23. 30.06.1994

    This book is a one-stop guide to the state of the art of COBtechnology. For professionals active ...

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    213,99 €
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  24. 31.05.1991

    Solders have given the designer of modern consumer, commercial, and military electronic systems a...

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    213,99 €
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  25. 03.10.2019

    Long since regarded as an inessential object that simply adds to the beauty, convenience or effec...

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    34,50 €
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  26. 04.06.2007

    In this volume, phenomenologists from the West join hands with specialists from mainland China an...

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    106,99 €
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  27. 01.12.2014

    Literatür Moda Tasariminin Temelleri Dizisinin dokuzuncu kitabi olan Aksesuar Tasarimi, arastirma...

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    59,99 €
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