The fast-developing information technology industry is driving a need for new materials in order ...
Keine ausführliche Beschreibung für 'Bondkontakte' verfügbar.
The conference was on reliability related science in ULSI interconnect. Its main purpose was to d...
One current challenge to micro- and nanoelectronics is the understanding of stress-related phenom...
Unser bisheriger Preis:ORGPRICE: 153,50 €
Scientist and engineers as well as graduate students in the fields of This conference will be of ...
Unser bisheriger Preis:ORGPRICE: 139,50 €
Stress-induced voiding and electromigration have emerged to become key reliability problems for s...
Unser bisheriger Preis:ORGPRICE: 124,50 €
The fast-developing information technology industry is driving a need for new materials in order ...
Unser bisheriger Preis:ORGPRICE: 213,99 €
These proceedings present current research on issues related to stress-induced phenomena in on-ch...